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HVM187WK
Silicon Epitaxial Planar PIN Diode for High Frequency Attenuator
ADE-208-056E (Z) Rev. 5 Jun. 1993 Features
* Low forward resistance. (rf = 5.5 max) * MPAK package is suitable for high density surface mounting and high speed assembly.
Ordering Information
Type No. HVM187WK Laser Mark H1 Package Code MPAK
Pin Arrangement
3
2
1
(Top View)
1 Anode 2 Anode 3 Cathode
HVM187WK
Absolute Maximum Ratings (Ta = 25C)
Item Reverse voltage Forward current Power dissipation Junction temperature Storage temperature Note: Per one device Symbol VR IF Pd* Tj Tstg Value 60 50 100 125 -55 to +125 Unit V mA mW C C
Electrical Characteristics (Ta = 25C)
Item Forward voltage Reverse current Capacitance Forward resistance ESD-Capability Symbol VF IR C rf -- Min -- -- -- 3.5 200 Typ -- -- -- -- -- Max 1.0 100 2.4 5.5 -- Unit V nA pF V Test Condition I F = 10mA VR = 60V VR = 0V, f = 1MHz I F = 10mA, f = 100MHz *C = 200pF, Both forward and reverse direction 1 pulse.
Note: Failure criterion; IR 100nA at VR = 60V
10
-2
10
-4
Forward current I F (A)
10-6
10
-8
10-10
10
-12
0
0.2
0.4
0.6
0.8
1.0
Forward voltage VF (V)
Fig.1 Forward current Vs. Forward voltage
2
HVM187WK
10
-8
Reverse current I R (A)
10
-9
10
-10
10
-11
10
-12
0
60 20 80 40 Reverse voltage VR (V)
100
Fig.2 Reverse current Vs. Reverse voltage
f = 1MHz
10 Capacitance C (pF)
1.0
10
-1
1.0
10 Reverse voltage VR (V)
10
2
Fig.3 Capacitance Vs. Reverse voltage
3
HVM187WK
10
4
f = 100MHz
Forward resistance r f ( )
10
3
10
2
10
1.0
10
-5
10
-4
10
-3
10
-2
Forward current I F (A)
Fig.4 Forward resistance Vs. Forward current
4
HVM187WK
Package Dimensions
Unit: mm
0.65 - 0.3
+ 0.1
Laser Mark
0.4 - 0.05
+ 0.10
0.16 - 0.06
+ 0.10
3
+ 0.2 - 0.6
0.1 0.65 + 0.3 -
2 0.95
1 0.95
2.8
H1
1.9
0.3 2.8 + 0.1 -
1.5
0 - 0.10
1 Anode 2 Anode 3 Cathode
0.3
1.1 - 0.1
+ 0.2
HITACHI Code JEDEC Code EIAJ Code Weight (g)
MPAK(1) -- SC-59A 0.011
5
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi's or any third party's patent, copyright, trademark, or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for problems that may arise with third party's rights, including intellectual property rights, in connection with use of the information contained in this document. 2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use. 3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachi's sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support. 4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product. 5. This product is not designed to be radiation resistant. 6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi. 7. Contact Hitachi's sales office for any questions regarding this document or Hitachi semiconductor products.
Hitachi, Ltd.
Semiconductor & Integrated Circuits. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109
URL
NorthAmerica : http:semiconductor.hitachi.com/ Europe : http://www.hitachi-eu.com/hel/ecg Asia (Singapore) : http://www.has.hitachi.com.sg/grp3/sicd/index.htm Asia (Taiwan) : http://www.hitachi.com.tw/E/Product/SICD_Frame.htm Asia (HongKong) : http://www.hitachi.com.hk/eng/bo/grp3/index.htm Japan : http://www.hitachi.co.jp/Sicd/indx.htm For further information write to:
Hitachi Semiconductor (America) Inc. 179 East Tasman Drive, San Jose,CA 95134 Tel: <1> (408) 433-1990 Fax: <1>(408) 433-0223 Hitachi Europe GmbH Electronic components Group Dornacher Strae 3 D-85622 Feldkirchen, Munich Germany Tel: <49> (89) 9 9180-0 Fax: <49> (89) 9 29 30 00 Hitachi Europe Ltd. Electronic Components Group. Whitebrook Park Lower Cookham Road Maidenhead Berkshire SL6 8YA, United Kingdom Tel: <44> (1628) 585000 Fax: <44> (1628) 778322 Hitachi Asia Pte. Ltd. 16 Collyer Quay #20-00 Hitachi Tower Singapore 049318 Tel: 535-2100 Fax: 535-1533 Hitachi Asia Ltd. Taipei Branch Office 3F, Hung Kuo Building. No.167, Tun-Hwa North Road, Taipei (105) Tel: <886> (2) 2718-3666 Fax: <886> (2) 2718-8180 Hitachi Asia (Hong Kong) Ltd. Group III (Electronic Components) 7/F., North Tower, World Finance Centre, Harbour City, Canton Road, Tsim Sha Tsui, Kowloon, Hong Kong Tel: <852> (2) 735 9218 Fax: <852> (2) 730 0281 Telex: 40815 HITEC HX
Copyright ' Hitachi, Ltd., 1999. All rights reserved. Printed in Japan.

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